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Title: Hygroscopic resin and humidity sensor using the same
Claims: What is claimed is: 1. A humidity sensor comprising a hygroscopic resin, which resin comprises a vinyl polymer having epoxy group, said vinyl polymer being a copolymerization product of (a) a hydrophylic vinyl monomer selected from the group consisting of 2-hydroxyethyl acrylate and 2-hydroxyethyl methacrylate and (b) a further vinyl monomer having an epoxy group and being selected from the group consisting of glycidyl acrylate and glycidyl methacrylate, the amount of said further vinyl monomer being from 1 to 30 mole percent on the basis of the weight of said copolymerization product, said hygroscopic resin having a electrically conductive powder dispersed therein, the amount of said electrically conductive powder being from 30 to 100 weight parts on the basis of 100 weight parts of said hygrosopic resin. 2. A humidity sensor according to claim 1, which further has added hereto a cross-linking reagent which reacts with said hygroscopic resin. 3. A humidity sensor comprising a hygroscopic resin according to claim 1, said hygroscopic resin having graphite as the electrically conductive powder dispersed therein, the amount of said graphite power being 30 to 100 weight parts on the basis of 100 weight parts of said hygroscopic resin. 4. A humidity sensor according to claim 3, which further has added hereto a cross-linking reagent which reacts with said hygroscopic resin. Other info: Inventors: Hatanaka, Hideo (Katano, JP) Murakami, Yoshinobu (Katano, JP) Morimoto, Kazuhisa (Settsu, JP) Application Number: 797117 Filing Date: 1977-05-16 Publication_date: 1978-10-17 Assignee: Matsushita Electric Industrial Co., Ltd. (JP) Primary Class(es): 252/194 526/263, 526/264, 526/273 Other Classes: US Patent Ref:
Other Refs: Primary Examiner: Lechert, Jr., Stephen J. Assistant Examiner: Attorney: Wenderoth, Lind & Ponack |
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