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Title: Index mounting unitary heat sink apparatus with apertured base
Claims: What is claimed is: 1. Unitary heat sink apparatus comprising a substantially U-shaped body of thermally conductive material, one leg of said U-shaped body providing a relatively broad area flat surface adapted to mate with the thermal transfer plate of a semiconductor encapsulation device and including indexing means protruding from said flat surface of said one leg for mating with indexing means provided in said encapsulation device, the opposite leg of said U-shaped body providing means for urging the thermal transfer plate of said encapsulation device into intimate contact with said one leg, and the base of said U-shaped body providing spring means for urging said opposite leg of said U-shaped body toward said one leg of said U-shaped body, said base further having an aperture therein for permitting the leads extending from said encapsulation device to extend therethrough. 2. Apparatus as defined in claim 2 wherein said indexing means on said flat surface is a raised dimple adapted to mate with a hole in the heat transfer plate of said encapsulation device. 3. Apparatus as defined in claim 1 wherein said one leg is wider than said opposite leg and includes fins extending from the edges thereof. 4. Apparatus as defined in claim 3 wherein said fins extend in a direction substantially normal to the plane of said flat surface. 5. Apparatus as defined in claim 1 including a first tab extending from said one leg substantially in the plane of said flat surface and extending past said base. 6. Apparatus as defined in claim 4 including a first tab extending from said one leg substantially in the plane of said flat surface and extending past said base, and further including fins extending from the edges of said one leg at the end thereof nearest said base and including a tab extending from each of such fins and parallel with said first tab. 7. Apparatus as defined in claim 1 including parallel ridges in said one leg defining the edges of said flat surface. 8. Apparatus as defined in claim 1 including parallel ridges in said first leg defining the lateral edges of said flat surface, and having parallel notches in said flat surface between and parallel with said ridges, said notches extending from the end of said one leg opposite said base toward said base, and wherein said indexing means is a raised dimple on the portion of said flat surface between said notches. 9. Apparatus as defined in claim 1 wherein said means for urging the thermal transfer plate of an encapsulation device into intimate contact with said one leg is a tab extending from said opposite leg toward said one leg. 10. The combination comprising: a. a semiconductor encapsulation package including a plastic body having leads extending from one end thereof and a thermal transfer plate adjacent and forming one major face of said body and having indexing means in said thermal transfer plate, and b. a unitary heat sink comprising a substantially U-shaped body of thermally conductive material, the inner surface of one leg of said U-shaped body mating with said thermal transfer plate and including indexing means protruding from said inner surface of said one leg and mating with said indexing means in said thermal transfer plate, the opposite leg of said U-shaped body providing means for urging said thermal transfer plate into intimate contact with said one leg; the base of said U-shaped body providing spring means for urging said opposite leg toward said one leg, said base further having an aperture therein; and said leads extending through said aperture. 11. The combination defined in claim 10 wherein said one leg is wider than said opposite leg and includes fins extending from the edges thereof. 12. The combination defined in claim 11 wherein said fins extend in a direction substantially normal to said first leg. 13. The combination defined in claim 10 including a first tab extending from said one leg substantially in the plane of said first leg and extending beyond said base. 14. The combination defined in claim 12 including a first tab extending from said one leg substantially in the plane of said one leg and extending parallel with said leads, and further including a fin tab extending from each of said fins nearest the base, said fin tabs extending beyond said base and parallel with said leads. 15. The combination defined in claim 10 including parallel ridges on the inner face of said one leg parallel with the edges of said thermal transfer plate. 16. The combination defined in claim 10 wherein the base of said U-shaped body is substantially wider than the thickness of said plastic body, and including flap means depending from said opposite leg for urging said plastic body toward said first leg. 17. The combination defined in claim 16 wherein said one leg and said opposite leg are of substantially the same width. Other info: Inventors: Edwards, Steven F. (Dallas, TX, US) Johnson, James A. (Lewisville, TX, US) Jordan, William D. (Dallas, TX, US) Pritchett, James D. (Dallas, TX, US) Application Number: 621665 Filing Date: 1975-10-14 Publication_date: 1977-10-18 Assignee: Thermalloy, Inc. (Dallas, TX) Primary Class(es): 257/718 165/80.3, 174/16.3, 257/722, 257/796, 257/E23.086 Other Classes: US Patent Ref:
Other Refs: Primary Examiner: James, Andrew J. Assistant Examiner: Attorney: Kanz; Jack A. |
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