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Title: Warp-resistant heat sink
Claims: What is claimed is: 1. A warp-resistant heat sink suitable for soldering to a relatively fragile, ceramic semiconductor substrate, wherein said heat sink comprises a rectangular heat-conducting plate having a plurality of slit-like openings along opposite edges thereof, said openings being normal to the edges, the openings along one edge being offset with respect to those along the opposite edge, said plate having a thermal coefficient of expansion substantially identical to that of said ceramic substrate; a plurality of U-shaped heat-conducting members, each of said members extending through a respective one of said openings in said plate, the members which extend through the openings along one edge of said plate all having an identical orientation and the members which extend through the openings along the opposite edge of said plate all having an identical orientation, the orientation of the members along one side being different from that of the members along the opposite side, one side of each of said members being secured to the same side of said plate, said members being formed of material having a different thermal coefficient of expansion than said plate, whereby when said heat sink plate is soldered to said substrate the laminate thereby formed comprises two outer layers of material having substantially identical thermal coefficients of expansion and an inner layer having a different theremal coefficient of expansion. 2. The heat sink according to claim 1, wherein said plate is comprised of Kovar, and said members are comprised of copper. 3. An air-cooled heat sink, comprising a rectangular plate having a plurality of slit-like openings along opposite edges thereof, said openings being normal to the edges, the openings along one edge being offset with respect to those along the opposite edge; a plurality of U-shaped heat-conducting members, each of said members extending through a respective one of said openings in said plate, the members along one edge all having an identical orientation and the members along the opposite edge all having an identical orientation, the orientation of the members along one edge being different from that of the members along the opposite edge, one side of each of said members being secured to the same side of said plate, whereby when air is directed through the members which are arranged along one edge of the plate the heat transfer efficiency of the heat sink is substantially increased as a result of inhibiting the formation of a thermal boundary layer along the members which are arranged along the opposite edge of the plate. 4. The heat sink according to claim 3, wherein said plate is comprised of Kovar, and said members are comprised of copper. Other info: Inventors: Wilson, Edward Arthur (Phoenix, AZ, US) Application Number: 552494 Filing Date: 1975-02-24 Publication_date: 1977-03-01 Assignee: Honeywell Information Systems Inc. (Phoenix, AZ) Primary Class(es): 165/81 165/185, 165/DIG51, 257/706, 257/722, 257/E23.103, 257/E23.109, 361/717 Other Classes: US Patent Ref:
Other Refs:
Primary Examiner: Davis, Jr., Albert W. Assistant Examiner: Attorney: Hughes; Edward W., Holloway, Jr.; William W. |
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