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Title: Wire maze penetrating apparatus
Claims: We claim: 1. Wire maze penetrating apparatus operative to remove wires from and open an area on a printed circuit board surface to permit the bonding of additional wire to the board surface, said apparatus comprising: a pair of needle-like penetrating members each connected to a support member at one end, with the other ends of said penetrating members normally proximate each other; means operative to position said apparatus above the area on the printed circuit board to which a bond is to be made; means operative to bring said penetrating members into contact with the surface of the printed circuit board; and pressure responsive apparatus connected to said support member and said penetrating members operative in response to pressure exerted on said penetrating members by said board surface to cause said penetrating members to spread apart and thereby open an area on said board surface. 2. Wire maze penetrating apparatus operative to penetrate a bundle of wires on the surface of a printed circuit board and to open an area on said board surface to permit the bonding of additional wire to the area on the board surface said apparatus comprising: a pair of needle like penetrating members each connected to a support member at one end with the other needle-like end of said penetrating members normally proximate each other, said pair of penetrating members being symmetrically disposed about a central axis; means operative to bring said penetrating members into contact with the surface of a printed circuit board; and pressure responsive apparatus connected to said needle-like penetrating members and said support member, said pressure responsive apparatus being operative in response to pressure exerted on said penetrating members by said board surface to spread across the board surface and thereby open an area on said board surface. 3. The invention according to claim 2, wherein said pressure responsive apparatus for each of said penetrating members comprises: a clevis bar attached to the top of said penetrating member; means connecting said clevis bar to said support member, whereby said clevis bar is free to rotate about a point on the means connected to said support member; a block assembly connected to said support member, said block assembly including a slot having a bearing therein, said slot operative to constrain the movement of said penetrating member to a predetermined plane; and biasing means connected between said support means and said penetrating member. 4. The invention according to claim 3 wherein said apparatus additionally comprises an adjustable screw member mounted in each of said clevis bars, each screw member operative to establish the relative position of the needle-like portion of its respective penetrating members. 5. The invention according to claim 2 wherein a first of said penetrating members is disposed beneath the second of said penetrating members, both of said members being equi-angularly disposed about a central axis. 6. The invention according to claim 2 wherein the tips of each of said penetrating members is formed to provide a flat surface at an angle of approximately 30.degree. with a horizontal plane. 7. The invention according to claim 2, wherein said pressure responsive apparatus of each of said penetrating members comprises: first and second angularly formed surfaces disposed on opposite sides of said member, one above the other, but approximately parallel to each other; first and second substantially vertical surfaces disposed, respectively, below and contacting said first and second angularly formed surfaces respectively; first and second roller means normally in contact with said angularly formed surfaces; and biasing means connected between said support means and said penetrating member, whereby said penetrating member is normally maintained in a downward position and is responsive to pressure on the tip of said member to slide up and outward on said roller means. Other info: Inventors: Houser, David Erle (Apalachin, NY, US) Lubert, Kenneth John (Endicott, NY, US) Morenus, Richard Jay (Endwell, NY, US) Application Number: 639951 Filing Date: 1975-12-11 Publication_date: 1976-11-02 Assignee: International Business Machines Corporation (Armonk, NY) Primary Class(es): 228/4.5 29/748, 228/5.1 Other Classes: US Patent Ref:
Other Refs: Other References: Steranko, "High-Density Bonding Tweezers," IBM Technical Disclosure Bulletin, vol. 10, No. 5, pp. 630-631 (1967). | |