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Title: Process for the double-sided exposure of a semiconductor or substrate plates, especially wafers, as well as apparatus for the purpose of parallel and rotational alignment of such a plate
Claims: I claim: 1. Process for the simultaneous double-sided exposure of a substrate plate, such as a semiconductor wafer, bearing a pre-disposed pattern on at least one surface through first and second exposure masks arranged in plane parallel, parallel and rotational alignment with each of said exposure masks being coordinated and in registry with one predetermined side of a wafer to be treated, characterized by the steps of: a. bringing the two exposure masks into contact in mutual plane-parallel alignment and thereafter aligning said masks into mutual plane parallel and plane rotational alignment; b. moving said masks relatively away from each other along an axis normal to the planes thereof, while retaining said mutual plane parallel and plane rotational alignments; c. forcing said substrate into plane-parallel air cushion free contact and into registry with a first of the two exposure masks ad fixing said plane-parallel alignment while maintaining said mutual plane parallel and plane rotational alignment between said masks; d. separating said wafer from said first exposure mask by a predetermined distance and performing a parallel and rotational alignment and registration of said wafer with respect to both exposure masks; e. moving said second exposure mask toward an opposed surface of said wafer while retaining the registry mutual plane parallel and mutual plane rotational alignments between said exposure masks with respect to each other and with respect to said wafer; and f. simultaneously exposing said wafer through said first and second exposure masks. 2. Apparatus for parallel and rotational alignment of a substrate plate such as a semiconductor wafer, or the like, relative to first and second exposure masks adapted to be effective to one to either of the two opposed major surfaces of the wafer, for the purpose of double-sided exposure thereof, and comprising: a. means for establishing an exposure beam path for said opposed surfaces of a wafer held by said apparatus; b. an adjustable wedge-error correction head for supporting the wafer for plane parallel adjustment of one major surface of the wafer relative to the first of said exposure masks; c. apparatus for moving the opposed surface of said wafer into contact with said second exposure mask; d. first support means for arranging and supporting said first exposure mask and including a rotational compound slide table, and having means for the plane parallel position calibration of said first exposure mask relative to one major surface of said wafer relative to a microscopic viewing device; e. a microscopic viewing device in viewing relationship with an exposure mask supported in said first support means; f. an auxiliary rotational compound slide table having a second mask support means for receiving the second of said exposure masks; and g. means coupling the drive slide of said first rotational compound slide table to the drive slide of said auxiliary rotational compound slide table, the arrangement being such that: 1. the first mask support means is connected to its associated rotational compound slide table through a support approachment guide means extending normal to the plane of travel of the first and second compound slide tables; 2. one of said mask supports being constructed as an adjustable wedge-error calibration frame in one of said compound slide tables; said wedge-error correction head being arranged to receive said wafer and being bearingly mounted to a swivel arm, with said swivel arm being pivotable in a rotational plane lying generally parallel to and intermediate the planes of displacement of said two rotational compound slide tables, said swivel arm being pivotally movable along an axis perpendicular to the planes of displacement of said first and second mask support means; 3. means on said swivel arm for moving said swivel arm together with a wafer disposed thereon toward the surface of a selected one of said exposure masks until contact is achieved between the surface of said wafer and the surface of said selected exposure mask; and 4. means on said swivel arm for releasably retaining said wafer for carrying said wafer to and from contact with said selected exposure mask. 3. The apparatus in accordance with claim 2 being particularly characterized in that the planes of travel of said two rotational compound slide tables extend generally horizontally and the two rotational compound slide tables are arranged in generally superimposed relationship, one over the other. 4. The apparatus in accordance with claim 3 being particularly characterized in that the mask support of the second rotational compound slide table is arranged below the mask support of said first rotational compound slide table for said first exposure mask and that means are provided for releasing said wafer from said wedge-error correction head and thereafter depositing said wafer onto said second exposure mask under the effect of the force of gravity. 5. Apparatus in accordance with claim 3 being particularly characterized in that the controllable support of the wedge-error correction head includes a smooth support plate having a group of substantially identical air nozzles on the outer surface thereof and distributed over the surface thereof, and means for selectively exposing said nozzles to air under reduced or super pressure. 6. Apparatus in accordance with claim 4 being particularly characterized in that means are provided for maintaining contact between said wafer and said second exposure mask by a force of approximately 100 Pond for a predetermined period of from 0.1 to 0.5 seconds. 7. Apparatus in accordance with claim 2 being particularly characterized in that said microscopic viewing apparatus is arranged for observation of said second mask support from a point below the first mask support, and is movable horizontally outwardly from the exposure beam path. 8. Apparatus in accordance with claim 2 being particularly characterized in that disposed adjacent to and above the said first mask support as well as adjacent to and below the said second mask support there is provided for each, on the side away from said wafer support, a fixed illuminating optical arrangement. 9. Apparatus for parallel and rotational alignment of a substrate plate such as a semiconductor wafer, or the like, relative to first and second exposure masks adapted to be effective to one to either of the two opposed major surfaces of the water, for the purpose of double-sided exposure thereof, and comprising: a. means for establishing an exposure beam path for said opposed surfaces of a wafer held by said apparatus; b. an adjustable wedge-error correction head for supporting the wafer for plane parallel adjustment of one major surface of the wafer relative to the first of said exposure masks; c. apparatus for moving the opposed surface of said wafer into contact with said second exposure mask; d. support means for arranging and supporting said first and second exposure masks and including first and second rotational compound slide tables, each having means for the plane parallel position calibration of said first and second exposure masks relative to one major surface of each of said wafers relative to a microscopic viewing device; e. a microscopic viewing device in viewing relationship with an exposure mask supported in each of said first and second support means; and f. means coupling the drive slide of said first rotational compound slide table to the drive slide of said second rotational compound slide table, the arrangement being such that: 1. said first and said seond mask support means being rigidly connected to their associated rotational compound slide tables and the drive slide of said first rotational compound slide table is connected with the drive slide of said second rotational compound slide table through a table approachment guide which extends generally perpendicularly to the point of travel of said two rotational compound slide tables; 2. one of said mask supports being constructed as an adjustable wedge-error calibration frame in one of said compound slide tables; said wedge-error correction head being arranged to receive said wafer and being bearingly mounted to a swivel arm, with said swivel arm being pivotable in a rotational plane lying generally parallel to and intermediate the planes of displacement of said two rotational compound slide tables, said swivel arm being pivotally movable along an axis perpendicular to the planes of displacement of said first and second mask support means; 3. means on said swivel arm for moving said swivel arm together with a wafer disposed thereon toward the surface of a selected one of said exposure masks until contact is achieved between the surface of said wafer and the surface of said selected exposure mask; and 4. means on said swivel arm for releasably retaining said wafer for carrying said wafer to and from contact with said selected exposure mask. 10. The apparatus in accordance with claim 9 being particularly characterized in that the planes of travel of said two rotational compound slide tables extend generally horizontally and the two rotational compound slide tables are arranged in generally superimposed relationship, one over the other. Other info: Inventors: Schmidt, Jean (Cluses, FR) Application Number: 416227 Filing Date: 1973-11-15 Publication_date: 1976-02-10 Assignee: Karl Suss KG (Munich, DT) Primary Class(es): 356/144 355/30, 355/132, 356/399 Other Classes: US Patent Ref:
Other Refs: Primary Examiner: Lawrence, James W. Assistant Examiner: Nussbaum, Marvin Attorney: Haugen; Orrin M. |
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