Title: One component water reduced epoxy adhesives

Abstract: A water based epoxy resin composition is disclosed. The epoxy resin is useful as an adhesive.

The composition comprises a modified diepoxide with a latent curative in aqueous medium. The diepoxide is modified by partial reaction with a polyoxyalkyleneamine containing variable amounts of ethylene oxide.

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Inventors: Waddill, Harold G. (Austin, TX)

Application Number: 06/434684
Filing Date: 1982-10-15
Publication_date: 1983-12-27
Assignee: TEXACO INC (US)

Primary Class(es): 523/417 528/407, 523/414, 528/98, 528/111
Other Classes: C08G59/10; C09J163/00; C08G59/00; C08L63/00; C08L63/02; C08G59/50
US Patent Ref:

3496138	February, 1970	Sellers et al.	528/111	ADDUCTS OF POLYGLYCOL DIAMINES AND CURABLE COMPOSITIONS COMPRISING POLYEPOXIDES AND SAID ADDUCTS
3609121	September, 1971	Lohse et al.	528/111	CURABLE EPOXY RESIN COMPOSITIONS CONTAINING NOVEL DISECONDARY DIAMINES
3645969	February, 1972	Harvey	528/111
4167498	September, 1979	Waddill	523/414	Water-based epoxy resin coating composition
4316003	February, 1982	Dante et al.	528/111	Epoxy resin curing agents

Other Refs:
Primary Examiner: Nielsen, Earl A.
Assistant Examiner:
Attorney: Kulason, Robert A.
Park, Jack H.
Morgan, Richard A.

Claims: <