Title: Desoldering apparatus

Abstract: A device for desoldering electronic components from circuit boards has a soldering nozzle which produces a solder wave that is directed from below the circuit board against the component to be desoldered; thereby dissolving previous solder bonds. The component can then be lifted out from above and suction is applied from below to the now-opened bores of the circuit board, to remove residual solder from them. A new component can then be installed, using the same equipment.

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Inventors: Fuchs, Gottfried (Dorfprozelten, DE)
Garrecht, Ewald (Wertheim-Sachsenh., DE)
Rieck, Lothar (Wertheim, DE)
Ruppel, Wolfgang (Kreuzwertheim-Rottbach, DE)
Schwarz, Rudolf (Schwieberdingen, DE)
Siegle, Erich (Eberdingen-Hochdorf, DE)

Application Number: 06/302077
Filing Date: 1981-09-14
Publication_date: 1983-11-01
Assignee: SACHS ERSA KG (DE)

Primary Class(es): 228/37 228/56.300, 228/191, 118/406
Other Classes: B23K1/018; B23K3/06; B23K3/00
US Patent Ref:

3815806	June, 1974	Paxton	228/56A	DESOLDERING FIXTURE
3834605	September, 1974	Coffin	228/20	PRINTED CIRCUIT CARD COMPONENT REMOVAL APPARATUS
3948212	April, 1976	Mayer	228/20	Coating apparatus
4066204	January, 1978	Wirbser et al.	228/20	Process and device for unsoldering semiconductor modules in the flip-chip technique
4162034	July, 1979	Pavlas	228/20	Ejector controlled soldering device
4187973	February, 1980	Fortune	228/20	Desoldering system for use with a soldering instrument

Other Refs:
Primary Examiner: Godici, Nicholas P.
Assistant Examiner: Jordan M.
Attorney: Fogiel, Max

Claims:

What is claimed