Title: Low-power electric contact

Abstract: A low-power electrical contact particularly suitable for switching and plug-in connections. The contact comprises an outer contact layer and a substrate composed of a copper base alloy. The contact layer consists essentially of an alloy of 35-55% by weight gold, 18-33.5% silver, 30-40% palladium, and (i) 1-6% indium, or (ii) 0.5-2% tin together with 0.5-2% indium. An intermediate layer of nickel or copper-nickel may be interposed between the contact layer and the substrate.

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Inventors: Aldinger, Fritz (Rodenbach, DE)
Biberbach, Elke (Rodenbach, DE)
Bischoff, Albrecht (Bruchkobel, DE)
Harmsen, Nils (Garden City, NY)

Application Number: 06/193178
Filing Date: 1980-10-01
Publication_date: 1982-07-13
Assignee: HERAEUS GMBH W C

Primary Class(es): 200/266 428/671, 200/269, 428/675, 428/629, 428/511, 428/508
Other Classes: H01H1/023; H01R13/03; H01H1/02; H01H1/02
US Patent Ref:

2400003	May, 1946	Hensel et al.	200/262
2793273	May, 1957	Underwood et al.	200/263
4050930	September, 1977	Motoyoshi et al.	200/266
4053728	October, 1977	Talento et al.	200/267
4069370	January, 1978	Harmsen et al.	200/268
4111690	October, 1978	Harmsen et al.	200/266
4138604	February, 1979	Harmsen et al.	200/267

Other Refs: DE1078774DE2354045DE2540956DE2637807DE2800436

March, 1960
May, 1975
June, 1978
July, 1978
December, 1979

Other References: A. Keil, Materials for Electrical Contacts, 1960, pp. 136-142.

Primary Examiner: Little, Willis
Assistant Examiner:
Attorney: Frishauf, Holtz, Goodman & Woodward

Claims: