Title: Method of assembly of microwave integrated circuits having a structurally continuous ground plane

Abstract: One or more MIC's (microwave integrated circuits) are included in an assembly having a structurally continuous ground plane of conductive material for the microwave circuitry. Individual MIC's are mounted on a carrier and attached thereto by a layer of a dielectric adhesive. The adhesive is in contact with and interposed between the lower side of each MIC substrate and the carrier which may be, for example, a metal chassis. The carrier serves as, or includes, the structurally continuous ground plane of conductive material. Ground plane metallization on the lower side of MIC substrates is thereby made unnecessary. The dielectric adhesive may be maintained in a liquid or tacky state to permit convenient removal from the assembly of an MIC requiring rework or replacement. In addition, the layer of dielectric adhesive provides a thermally conductive path between an MIC and the carrier making the invention particularly well suited for MIC assemblies which are intended to be operated in a vacuum.

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Inventors: Gehle, Richard W. (Yorba Linda, CA, US)

Application Number: 031815
Filing Date: 1979-04-20
Publication_date: 1980-12-30
Assignee: Rockwell International Corporation (El Segundo, CA)
Primary Class(es): 156/64 29/593, 156/152, 156/298, 156/299, 156/327, 156/329, 257/E23.172, 438/15
Other Classes:
US Patent Ref:

2708650	May, 1955	Pullman et al.	156/332.
2731378	Jan, 1956	Strachan	156/64.
2925193	Feb, 1960	Gibb	156/91.
3581375	Jun, 1971	Rottmann	29/407.
3604108	Sep, 1971	Mallery	29/593.
3615946	Oct, 1971	Palmer	264/272.
3658618	Apr, 1972	Gramann	156/299.
3693252	Sep, 1972	Robertson et al.	264/272.
3992236	Nov, 1976	Wanesky	156/344.
4102039	Jul, 1978	Henrickson et al.	29/593.

Other Refs:
Primary Examiner: Gallagher, John J.
Assistant Examiner:
Attorney: Hamann; H. Fredrick, Friedman; Gilbert H.