Title: Copper-boron carbide composite particle and method for its production

Abstract: A process for manufacturing radiation shield structures of the type consisting of neutron absorbing boron carbide particles embedded in a copper matrix. The material comprises a multiplicity of particles comprising a core of boron carbide, a film of electroless copper bonded to the carbide, and a relatively thick electrodeposited copper layer bonded to the film. The particles are then consolidated to produce shield structures by hot rolling or hot pressing, with or without sintering.

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Inventors: Wang, Chih-Chung (Lexington, MA, US)

Application Number: 901843
Filing Date: 1978-05-01
Publication_date: 1980-10-14
Assignee: Kennecott Copper Corporation (New York, NY)
Primary Class(es): 75/238 419/17, 419/35, 428/570, 976/DIG319
Other Classes:
US Patent Ref:

1986197	Jan, 1935	Harshaw	75/212.
2033240	Mar, 1936	Hardy	75/212.
2200258	May, 1940	Boyer	75/238.
3367398	Feb, 1968	Riley et al.	75/212.
3838982	Oct, 1974	Sanderow et al.	75/212.

Other Refs:
Primary Examiner: Hunt, Brooks H.
Assistant Examiner:
Attorney: Sniado; John L., Lorusso; Anthony M.