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Title: Electrical interconnection apparatus
Abstract:
Electrical interconnection apparatus for mounting integrated circuit modules and for adapting the terminal pattern of the densely spaced leads of a module to the terminal pattern of the more widely spaced pin sockets of a printed wiring board. Rows of terminals (19, 20), spaced to conform to the module leads, are arranged on two sides of a module support platform (10) and are extended by conducting elements (27, 28, 29, 30) to particular terminal pins of a plurality of rows of terminal pins (21, 22, 23, 24, 25, 26) extending from the underside of lead frame blocks (11, 12) retained by the support platform (10). Ground plane elements (15, 16, 17, 18) are featured which are supported by the lead frame blocks (11, 12) between the terminal pin rows (21, 22, 23, 24, 25, 26) to control the impedance of the conducting elements (27, 28, 29, 30).
Other info: Inventors: Deo, Subhash R. (Naperville, IL, US) Faudskar, Chester C. (Wheaton, IL, US) Application Number: 061753 Filing Date: 1979-07-30 Publication_date: 1980-10-07 Assignee: Bell Telephone Laboratories, Incorporated (Murray Hill, NJ) Primary Class(es): 439/70 439/608 Other Classes: US Patent Ref:
Other Refs: Other References: IBM Bulletin, Honn, vol. 15, No. 1, p. 308, 6-1972. IBM Bulletin, Benenati, vol. 20, No. 6, p. 2221, 11-1977. | |