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Title: Vapor deposition apparatus

Abstract: An apparatus for vacuum deposition of a thin film onto the surface of a substrate includes a vacuum container formed by a base plate, a cylindrical side wall and a top plate to accommodate at least four movable sealing caps each having a space adapted to confine a batch of substrates on a carrier of dome shape. The caps move around the center of the base plate. When the caps are stopped to cover respective openings provided through the base plate, there are established a pre-heating, a vapor depositing, a cooling and an air locking chamber, and the batch of processed substrates in the air locking chamber is moved to the outside of the apparatus without disturbing the vacuum in the container. Next, the air locking chamber, after having received a new batch of unprocessed substrates at the space of the cap thereof, is sealed from the ambient atmosphere, and all the caps are advanced one step ahead. The controlled atmosphere in the lower section of the vapor depositing chamber remains almost unchanged during this time to insure that uniform, thin-film layers of deposited material are applied to the substrates. Further, to eliminate fluctuation in quality among manufactured lots, there is provided a novel evaporant feeding mechanism.


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Inventors: Nishida, Keijiro (Nimomiya, JP)
Kakei, Mitsuo (Tokyo, JP)
Kamiya, Osamu (Yokohama, JP)
Sekimura, Nobuyuki (Yokohama, JP)

Application Number: 928435
Filing Date: 1978-07-27
Publication_date: 1980-10-07
Assignee: Canon Kabushiki Kaisha (Tokyo, JP)
Primary Class(es): 118/706 118/50.1, 118/503, 118/504, 118/719, 118/724, 118/725, 118/726, 118/730, 118/733, 414/939
Other Classes:
US Patent Ref:
3981791Sep, 1976Rosvold118/49.

Other Refs: 38-25633
Nov, 1963JP.

Primary Examiner: Pianalto, Bernard D.
Assistant Examiner:
Attorney: Toren, McGeady and Stanger