Title: Multi-layer flexible printed circuit board assembly

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Abstract: A multi-layer flexible printed circuit board assembly, having at least two flexible printed circuit boards with electrical conductive layers piled one on another. The conductive layers face in the same direction and a portion of the lower flexible printed circuit board is not covered with the upper flexible printed circuit board. Hence, some of the lead wires of an electronic component can be connected to the electrical conductive layer of the upper flexible printed circuit board, and the remaining lead wires can be connected to said electrical conductive layer of the lower flexible printed circuit board. The portion of the lower flexible printed circuit board which is not covered by the upper flexible printed circuit board is raised so that the surface of a copper foil layer on the upper flexible printed circuit board is substantially flush with the surface of a copper foil layer on the lower flexible printed circuit board.


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