Title: Additive method of forming circuit crossovers

• Summary
• Claims
• Description
• View all

Abstract: Through the use of a uniquely constructed molybdenum frame, a completely additive fabrication method may advantageously be employed to form an array of minute interconnecting circuit crossovers directly on the frame, using photolithographic and plating processes, with the requisite arches of the crossovers being directly formed within specially configured grooves of the frame during the plating operation. The frame is thereafter initially used as a temporary crossover carrier member, and subsequently as a bonding member during the thermo-compression bonding of the individual crossovers to respectively associated bond sites of the circuit, which typically may be of the integrated thin or thick film type. Such a simplified additive crossover generating technique advantageously obviates the need of not only potentially circuit-damaging chemical etching operations, but the many associated processing and handling steps associated therewith.


Do you think this is a good invention? Vote now: