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Title:
VMOS transistor and method of fabrication
Abstract:
A vertical insulated gate field effect transistor having a first first conductivity layer, a second second conductivity layer thereon, a third first conductivity layer thereon, a groove extending from the surface of the third layer through the second layer into the first layer, a layer of insulation and gate material in the groove and a shallow first conductivity vertical region extending from the third layer into the second layer along the groove to form a short channel in the second layer with a shallow device junction. The device is fabricated by masking the three semiconductor layers and etching the third layer and part of the second layer to form a groove, diffusing second conductivity impurities to a shallow depth in the groove, continue the etching to extend the groove through the second layer into the first layer. A layer of insulation and gate material are formed in the groove to produce the vertical channel.
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Inventors:
Schroeder, James E. (Indialantic, FL, US)
Application Number:
932232
Filing Date: 1978-08-09 Publication_date: 1980-05-06 Assignee:
Harris Corporation (Melbourne, FL)
Primary Class(es):
438/271
148/DIG25, 148/DIG53, 148/DIG145, 257/E21.223, 257/E29.04, 257/E29.131, 438/282
Other Classes:
US Patent Ref:
Other Refs:
Primary Examiner:
Tupman, W. C.
Assistant Examiner:
Attorney:
Leitner, Palan, Lyman, Martin & Bernstein
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