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Title: VMOS transistor and method of fabrication

Abstract: A vertical insulated gate field effect transistor having a first first conductivity layer, a second second conductivity layer thereon, a third first conductivity layer thereon, a groove extending from the surface of the third layer through the second layer into the first layer, a layer of insulation and gate material in the groove and a shallow first conductivity vertical region extending from the third layer into the second layer along the groove to form a short channel in the second layer with a shallow device junction. The device is fabricated by masking the three semiconductor layers and etching the third layer and part of the second layer to form a groove, diffusing second conductivity impurities to a shallow depth in the groove, continue the etching to extend the groove through the second layer into the first layer. A layer of insulation and gate material are formed in the groove to produce the vertical channel.


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Inventors: Schroeder, James E. (Indialantic, FL, US)

Application Number: 932232
Filing Date: 1978-08-09
Publication_date: 1980-05-06
Assignee: Harris Corporation (Melbourne, FL)
Primary Class(es): 438/271 148/DIG25, 148/DIG53, 148/DIG145, 257/E21.223, 257/E29.04, 257/E29.131, 438/282
Other Classes:
US Patent Ref:
3975221Aug, 1976Rodgers29/571.
4003126Jan, 1977Holmes29/571.
4056413Nov, 1977Yoshimura29/580.
4105475Aug, 1978Jenne29/580.

Other Refs:
Primary Examiner: Tupman, W. C.
Assistant Examiner:
Attorney: Leitner, Palan, Lyman, Martin & Bernstein