Title: Magnetic domain packaging

Abstract: A magnetic bubble device is provided comprising a substrate, a device chip and interconnecting conductors for connecting the device chip to the substrate and for supporting the device chip on the substrate so that by providing a hole in the substrate and turning over the device chip, the active surface of the device chip is arranged substantially co-planar with the top surface of the substrate, thereby enabling a reduced height device to be obtained.

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Inventors: Cooper, Paul V. (Northampton, GB)
Adamson, Steven J. (Towcester, GB)

Application Number: 900143
Filing Date: 1978-04-26
Publication_date: 1980-03-04
Assignee: Plessey Handel und Investments AG (Zug, CH)
Primary Class(es): 365/2
Other Classes:
US Patent Ref:

4096581

Jun, 1978

Carlo

365/2.

Other Refs:
Primary Examiner: Moffitt, James W.
Assistant Examiner:
Attorney: Fleit & Jacobson