Title: Multiple component circuit board cooling device

Abstract: A device for cooling a multiplicity of solid state components which are attached to a printed circuit board comprises a formed profile member of high thermal conductivity material having a pair of longitudinally connected sides which form a geometrically shaped channel extending along its entire length for dissipation of thermal energy away from the components. The sides of the device are formed to provide a resilient springlike characteristic for frictionally engaging and holding the device in intimate contact with the surfaces of the solid state components to be cooled. This same characteristic facilitates manual installation and removal of the cooling device without the need for or use of special tools.

Do you think this is a good invention? Vote now:

Votes so far: For:(0) Against:(0)
Other info:

Inventors: Hanlon, Alfred G. (Poway, CA, US)

Application Number: 878501
Filing Date: 1978-02-16
Publication_date: 1980-02-26
Assignee: NCR Corporation (Dayton, OH)
Primary Class(es): 165/80.3 257/718, 257/721, 257/E23.086, 361/684, 361/687, 361/690
Other Classes:
US Patent Ref:

2838740	Jun, 1958	Larky et al.	165/80.
2840629	Jun, 1958	Roth et al.	165/80.
3305004	Feb, 1967	Barlowe	165/80.
3519889	Jul, 1970	Monaco	361/388.
3572428	Mar, 1971	Monaco	165/80.
3874443	Apr, 1975	Bayer	174/16.
4041524	Aug, 1977	Trunk et al.	165/80.

Other Refs:
Primary Examiner: Richter, Sheldon
Assistant Examiner:
Attorney: Cavender; J. T., Jewett; Stephen F., Dugas; Edward