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Title:
Nonalloyed ohmic contacts to n-type Group III(a)-V(a) semiconductors
Abstract:
A nonalloyed ohmic contact (110-112, 120-122) to an n-type Group III(a)-V(a) compound semiconductor body (102-104) is formed by epitaxially growing a Group III(a)-V(a) n.sup.++ -layer (106-108, 106'-108') doped to at least 10.sup.19 cm.sup.-3 between the semiconductor body and a metal contact layer (110-112). The metal layer forms an ohmic contact without requiring heating above the eutectic temperature. In order to avoid contamination of the metal-semiconductor interface, a metal contact layer (120-122) may be deposited in situ after MBE growth of the n.sup.++ -layer. This technique results in both a metal-semiconductor interface with smoother morphology and also an ohmic contact without heating above the eutectic temperature. These procedures are specifically described with reference to the fabrication of GaAs FETs.
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Inventors:
Cho, Alfred Y. (Summit, NJ, US) Di Lorenzo, James V. (Millington, NJ, US) Niehaus, William C. (Murray Hill, NJ, US)
Application Number:
919624
Filing Date: 1978-06-27 Publication_date: 1980-01-29 Assignee:
Bell Telephone Laboratories, Incorporated (Murray Hill, NJ)
Primary Class(es):
257/280
148/DIG18, 148/DIG20, 148/DIG88, 257/485, 257/743, 257/763, 257/E21.097, 257/E21.172, 257/E29.144, 257/E29.317, 438/571, 438/606
Other Classes:
US Patent Ref:
Other Refs:
Primary Examiner:
James, Andrew J.
Assistant Examiner:
Attorney:
Urbano; Michael J.
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