Title: Electronic assembly with heat sink means

Abstract: An electronic assembly consisting of at least a pair of modules, a control and power semiconductor module and a filter module interconnected by means permitting ease of assembly and disassembly. The control and power semiconductor module comprises a pair of spaced heat sinks forming side enclosures for the assembly and connected by bracket means to a printed circuit board (PCB) which mounts electronic components on its upper face including high heat generating elements carried by the bracket means. The PCB is located at one end of the heat sinks which is secured at their other end to the base of the filter module. The large capacitors and reactors supported on the base nest in the chamber or cavity formed by the PCB and heat sinks to provide a compact assembly.

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Other info:

Inventors: Volkmann, Werner K. (Media, PA, US)

Application Number: 850911
Filing Date: 1977-11-14
Publication_date: 1979-12-04
Assignee: Volkmann Electric Drives Corporation (Folcroft, PA)
Primary Class(es): 361/710 361/690, 361/716
Other Classes:
US Patent Ref:

3518493	Jun, 1970	Bathric, Jr.	361/388.
3780798	Dec, 1973	Reimer	361/383.
3940665	Feb, 1976	Seki	361/383.
4006388	Feb, 1977	Bartholomew	361/383.
4027206	May, 1977	Lee	361/384.

Other Refs:
Primary Examiner: Tolin, Gerald P.
Assistant Examiner:
Attorney: Renz, Jr.; Eugene E.