Title: Encapsulation of circuits

Abstract: Disclosed is a technique for the protection of micro-electronic circuits. A room temperature vulcanizing silicone rubber is applied over the circuit. While the rubber is in an uncured state, a solvent-resistant cover coating is applied thereon. The resulting structure is then treated so that both layers cure simultaneously. The resulting dual layer provides protection against contaminants and solvents used in the circuit fabrication. In addition, mechanical protection is provided for crossovers and circuit chips.

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Inventors: Soos, Nicholas A. (Macungie, PA, US)

Application Number: 804439
Filing Date: 1977-06-07
Publication_date: 1979-07-31
Assignee: Bell Telephone Laboratories, Incorporated (Murray Hill, NJ)
Primary Class(es): 427/96 257/790, 257/E21.502, 257/E23.125, 257/E23.126, 257/E23.134, 257/E25.029, 427/282, 427/377, 427/379, 427/386, 427/387, 427/407.1, 427/420
Other Classes:
US Patent Ref:

3254282	May, 1966	West	357/72.
3429981	Feb, 1969	Shallahamer	174/52.
3441813	Apr, 1969	Takatsuka	357/72.
3496427	Feb, 1970	Lee	357/72.
3566208	Feb, 1971	Wang	357/72.
3762939	Oct, 1973	Hunter	427/379.
3778685	Dec, 1973	Kennedy	357/72.
3821611	Jan, 1974	Bacher	427/96.
3911178	Oct, 1975	McDowell	427/379.
3946427	Mar, 1976	Iwasawa	357/72.
4017495	Apr, 1977	Jaffe	264/272.

Other Refs: 5030676

Feb, 1975	JP

Primary Examiner: Esposito, Michael F.
Assistant Examiner:
Attorney: Birnbaum; Lester H.