Title: Process for electroless copper deposition from an acidic bath

Abstract: An electroless plating process for copper in an acidic bath whereby copper by a chemical reduction process is continuously being plated to a desired thickness on a suitable substrate; this process is especially applicable to plating of copper and substrates which are susceptible to alkaline solutions such as polyimides, polyparabanic acids, etc.

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Inventors: Davis, Thomas F. (Harrisburg, PA, US)

Application Number: 815409
Filing Date: 1977-07-13
Publication_date: 1979-03-06
Assignee: AMP Incorporated (Harrisburg, PA)
Primary Class(es): 427/345 106/1.21, 106/1.23, 427/98, 427/305, 427/306, 427/443.1
Other Classes:
US Patent Ref:

3431120	Apr, 1969	Weisenberger	427/437.
3615733	Oct, 1971	Shipley et al.	106/1.
3736170	May, 1973	Lo	427/304.
3791848	Jun, 1973	De Angelo	427/306.

Other Refs: Other References: Pearlstein et al., Plating, vol. 60, pp. 474 to 476 (1973).
Modern Electroplating, John Wiley & Sons, pp. 734, 735 c 1974.
Brenner, "Electroless Plating Comes of Age" Metal Finishing, Nov., 1954.