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Primary Examiner: Werner, Frank E.
Assistant Examiner:
Attorney: Christoffersen; H., Williams; R. P., Asman; Sanford J.

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Title: Apparatus and method for aligning wafers

Abstract: The device includes an alignment station at which an operator can align a wafer under a microscope. Once the wafer is properly aligned, a transfer chuck is brought into position above the wafer and aligned with alignment pins located in fixed positions at the alignment station. The wafer is then fixed to the transfer chuck and released from the alignment station. The transfer chuck is moved into proper alignment with alignment pins at a remote operation station, such as an automatic scribing station. The invention allows the operator to view the wafer with semiconductor devices facing the operator and provides for flipping the wafer over through the use of the transfer chuck so that the laser scriber can scribe the wafer on the side away from the semiconductor devices.

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Inventors: Hart, Lewis F. (Bridgewater, NJ, US)

Application Number: 718825
Filing Date: 1976-08-30
Publication_date: 1979-02-27
Assignee: RCA Corp. (New York, NY)
Primary Class(es): 414/787 29/271, 29/406, 29/743, 29/759, 219/121.68, 219/121.82, 219/121.83, 219/158
Other Classes:
US Patent Ref:

3272350	Sep, 1966	Pflaumer et al.	214/152.
3611561	Dec, 1971	Dosier	29/759.
3816700	Jun, 1974	Weiner et al.	219/121.
4042119	Aug, 1977	Hassan et al.	214/1.

Other Refs: 2540431

May, 1976	DE

Other References: Keen et al.,--"Photosensitive System For Orienting a Translucent Substrate"--Digest #21-Western Electric, Jan. 1971 --pp. 17-19.
Finu et al.--"Bernoulli Wafer Load & Unloading System"--pp. 427 and 428--vol. 16, No. 2, Jul. 1973 IBM Tech. Disc.