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Title:
Process for manufacturing a radiation hardened oxide
Abstract:
A pyrogenic oxide is grown on a silicon wafer in a furnace by oxidizing hydrogen in the presence of an excess amount of oxygen as well as anhydrous hydrogen chloride to produce steam within the furnace. After growing a suitable pyrogenic oxide layer, the hydrogen and hydrogen chloride flows are turned off while the oxygen flow is continued to grow a dry oxide. A nitrogen anneal while the wafer is slowly pulled from the furnace completes the hybrid, radiation hard oxide layer.
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Inventors:
Cohen, Seymour H. (Berkeley Heights, NJ, US) Fabula, Joseph J. (Somerville, NJ, US)
Application Number:
698924
Filing Date: 1976-06-23 Publication_date: 1979-02-13 Assignee:
RCA Corp. (New York, NY)
Primary Class(es):
438/773
148/DIG3, 257/632, 257/906, 257/E21.285, 438/774, 438/953
Other Classes:
US Patent Ref:
Other Refs:
Other References:
Deal, Oxidaton of Silicon in Dry Oxygen, Wet Oxygen and Steam, Journ. of Electrochemical Society 6/63, pp. 527-533, vol. 10, No. 6. |