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Title: Attachment of leads to electrical components

Abstract: An electrical component, comprising an insulating substrate having conductive material applied to one side thereof and including terminal pad portions for attaching electrically connecting leads thereto, in which said leads are provided with relatively thick rigid portions adapted to extend externally of the component to provide means for making electrical connections thereto and have relatively thinner, less rigid portions mechanically bonded to the other side of said substrate and have end portions dressed around the edge of said substrate to said one side thereof and electrically connected to said terminal pad portions by brazing, welding or soldering. In a preferred form, said leads may be bonded to said substrate by epoxy or other suitable cement and the end portions thereof may be made even thinner than the remainder of said thinner portions to facilitate dressing them around the edge of said substrate into contact with said terminal pad portions.


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Inventors: Resnicow, Leon (Devon, PA, US)

Application Number: 742030
Filing Date: 1976-11-15
Publication_date: 1979-02-06
Assignee: Vishay Intertechnology, Inc. (Malvern, PA)
Primary Class(es): 338/322 338/329
Other Classes:
US Patent Ref:
1608005Nov, 1926Schoeppler338/324.
2718576Sep, 1955Kratochvil et al.338/329.
3071844Jan, 1963Krause et al.339/276.
3238429Mar, 1966Bornhorst361/310.
3488618Jan, 1970Yungblut et al.338/164.
3497860Feb, 1970Patto, Jr.339/176.
3688245Aug, 1972Lockshaw339/278.
3718883Feb, 1973Berman338/322.

Other Refs:
Primary Examiner: Albritton, C. L.
Assistant Examiner:
Attorney: Ferrill and Logan