Title: Thin film interconnect for multicolor IR/CCD

Abstract: A hybrid mosaic IR/CCD focal plane structure is fabricated using planar thin film interconnects. Rows of detectors are formed on an integrated circuit substrate so that the rows of detectors are adjacent to rows of electrical contacts on the integrated circuit. Contact pads are plated onto the rows of contacts and the regions between adjacent rows of detectors are backfilled with an insulating material. The insulating material is then lapped to expose the contact pads and to form an essentially coplanar surface with the detectors. Thin film interconnects are formed over the coplanar surface between the exposed contact pads and detectors in the adjacent row.

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Inventors: White, William J. (Chelmsford, MA, US)

Application Number: 829744
Filing Date: 1977-09-01
Publication_date: 1979-02-06
Assignee: Honeywell Inc. (Minneapolis, MN)
Primary Class(es): 438/60 257/232, 257/E21.545, 257/E21.575, 257/E27.161, 438/67
Other Classes:
US Patent Ref:

3481777	Dec, 1969	Spannhake	29/625.
3805375	Apr, 1974	La Combe	29/577.
3961414	Jun, 1976	Humphreys	29/577.

Other Refs:
Primary Examiner: Tupman, W.
Assistant Examiner:
Attorney: Neils; Theodore F., Fairbairn; David R.