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Title: Method for evaluating the quality of electroplating baths
Abstract:
A working electrode is swept through a voltammetric cycle, including a metal plating range and a metal stripping range, for at least two baths of known plating quality and a bath whose quality is to be evaluated. The current utilized during the metal stripping range is correlated to the quality of the baths of known quality. The current utilized to strip the metal in the bath of unknown quality is compared to the correlation and its quality evaluated. In a preferred embodiment, an inert working electrode is swept by a function generator through the voltammetric cycle. A counter electrode immersed in the plating bath is coupled in series with the function generator and a coulometer to measure the charge during the metal stripping portion of the cycle.
Other info: Inventors: Tench, Dennis M. (Thousand Oaks, CA, US) Ogden, Cameron A. (Thousand Oaks, CA, US) Application Number: 754476 Filing Date: 1976-12-27 Publication_date: 1979-01-02 Assignee: Rockwell International Corporation (El Segundo, CA) Primary Class(es): 205/787 204/434 Other Classes: US Patent Ref:
Other Refs: Other References: Adams, "Electrochemistry at Solid Electrodes", New York, Marcel Dekker, Inc., 1969, pp. 139, 143-160. Willard et al., "Instrumental Methods of Analysis", 5th ed., 1974, pp. 652 & 653. | |