Title: Thermosetting resin composition

Abstract: A thermosetting resin composition comprising a polyfunctional epoxy compound such as diglycidyl ether of bisphenol A, a polyfunctional isocyanate such as diphenylmethane diisocyanate, a curing agent and a polybutadiene type homopolymer having terminal hydroxyl groups or copolymer having terminal amino groups, or a reaction product of a polyfunctional epoxy compound or an epoxy compound having halogen atom(s) and a polybutadiene type homopolymer or copolymer having terminal hydroxyl groups or terminal carboxyl groups can produce cured articles excellent in heat resistance, crack resistance and fire resistance.

Do you think this is a good invention? Vote now:

Votes so far: For:(0) Against:(0)
Other info:

Inventors: Goto, Kazuo (Hitachi, JP)
Toyoda, Shinichi (Katsuta, JP)
Sakai, Masahiko (Hitachi, JP)

Application Number: 843206
Filing Date: 1977-10-18
Publication_date: 1978-12-19
Assignee: Hitachi Chemical Company, Ltd. (JP)
Primary Class(es): 528/73 525/111, 525/119, 525/122, 528/75
Other Classes:
US Patent Ref:

3459828	Aug, 1969	Michelotti et al.	260/830.
3496250	Feb, 1970	Czerwinski	260/836.
3525779	Aug, 1970	Hawkins	260/830.
3636133	Jan, 1972	Hawkins	260/824.
4055541	Oct, 1977	Riew	260/47.

Other Refs:
Primary Examiner: Anderson, Harold D.
Assistant Examiner: Nielsen, E. A.
Attorney: Craig & Antonelli