Title: Hygroscopic resin and humidity sensor using the same

Abstract: There is provided a hygroscopic resin comprising a vinyl polymer having an epoxy group, said vinyl polymer being a copolymerization product between a vinyl monomer having a hydrophilic property and a further vinyl monomer having an epoxy group. This hygroscopic resin is not soluble in water or organic solvent and is thus useful for various applications, e.g., a humidity sensor can be made by dispersing a conductive powder in the hygroscopic resin. This humidity sensor has high sensitivity to humidity and can operate stably for a long time.

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Inventors: Hatanaka, Hideo (Katano, JP)
Murakami, Yoshinobu (Katano, JP)
Morimoto, Kazuhisa (Settsu, JP)

Application Number: 797117
Filing Date: 1977-05-16
Publication_date: 1978-10-17
Assignee: Matsushita Electric Industrial Co., Ltd. (JP)
Primary Class(es): 252/194 526/263, 526/264, 526/273
Other Classes:
US Patent Ref:

3545622	Dec, 1970	Sakhnovsky et al.	252/194.
4041437	Aug, 1977	Matsuura et al.	252/194.

Other Refs:
Primary Examiner: Lechert, Jr., Stephen J.
Assistant Examiner:
Attorney: Wenderoth, Lind & Ponack