Title: Environmentally protected electronic housing and heat sink structure, particularly for automotive use

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Abstract: To mount power semiconductor units at the exposed surfaces of a housing structure for electronic components such as, for example, transistorized ignitions, without the loss of heat sink and heat radiation effects, while still protecting the electronic components, a protective cover is placed over the electronic component and at least a portion of the housing end wall, the cover being so dimensioned that it offers little resistance to radiation of heat by the housing end wall; the cover may be a layer of paint or a plastic hood or cap having end walls fitting against the housing end wall which are spaced from the electronic component by a distance which is sufficient to permit the housing end wall to act as a heat sink. If paint is used, the semiconductor is preferably located in a depression formed in the housing end wall so that paint can accumulate at the edges of the semiconductor thus providing effective protection.


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