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Primary Examiner: Miller, Jr., Stanley D.
Assistant Examiner: Davie, James W.
Attorney: Hopgood, Calimafde, Kalil, Blaustein & Lieberman

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Title: Semiconductor laser device equipped with a silicon heat sink

Abstract: A semiconductor laser device in which at least one of the main surfaces of a semiconductor laser crystal body which generates heat during operation is brought into thermal contact with a silicon crystal heat-sink body.

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Inventors: Sakuma, Isamu (Tokyo, JA)
Yonezu, Hiroo (Tokyo, JA)
Nishida, Katsuhiko (Tokyo, JA)
Kamejima, Taibun (Tokyo, JA)
Yuasa, Tonao (Tokyo, JA)
Ueno, Masayasu (Tokyo, JA)
Uji, Toshio (Tokyo, JA)
Nannichi, Yasuo (Tokyo, JA)
Hayashi, Izuo (Tokyo, JA)

Application Number: 757684
Filing Date: 1977-01-07
Publication_date: 1978-05-30
Assignee: Nippon Electric Co., Ltd. (Tokyo, JA)
Primary Class(es): 372/36 372/50
Other Classes:
US Patent Ref:

3303432	Feb, 1967	Garfinkel et al.	331/94.
3458703	Jul, 1969	Migitaka	307/312.
3535532	Oct, 1970	Merryman	457/19.
3560750	Feb, 1971	Nagata	357/19.
3566215	Feb, 1971	Heywang	357/94.
3622406	Nov, 1971	Nyal	357/94.
3628048	Dec, 1970	Lee et al.	307/312.
3641459	Feb, 1972	Paoli et al.	357/19.

Other Refs: Other References: Patlach, "Laser Packaging" IBM Technical Disclosure Bulletin, vol. 13, No. 2, Jul. 1970, pp. 337-338.
Hutchins, IBM Technical Disclosure Bulletin, vol. 17, No. 1, Jun. 1974, p. 282.