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Title: Methods and apparatus for positioning an article laterally on a support
Abstract:
Subassemblies, comprising an integrated circuit bonded to a conductor pattern on a small ceramic substrate, are automatically bonded to lead frames. In carrying out this operation, each subassembly is placed on a support and precisely positioned thereon. Rollers are symmetrically disposed about the centerline of a resiliently mounted roller support or yoke. The minimum distance between opposite rollers is less than the distance across the subassembly and the centerline is coincident with the position desired on the support. The yoke and rollers are advanced toward the subassembly to contact it and shift it on the support until opposite rollers contact opposite sides of the subassembly. At that time the assembly is positioned and the advancement of the rollers stops. Vacuum is applied to maintain the position of the subassembly on the support for bonding.
Other info: Inventors: McCorkle, Richard A. (Allentown, PA, US) Application Number: 742930 Filing Date: 1976-11-18 Publication_date: 1978-01-24 Assignee: Western Electric Co., Inc. (New York, NY) Primary Class(es): 414/787 29/25.01, 29/825, 29/827, 29/834, 198/345.1, 228/49.1, 298/32, 414/800 Other Classes: US Patent Ref:
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