Title: Heat sink mechanism hydraulically propelled into contact with semiconductor devices

Abstract: An arrangement including a hydraulic chamber for simultaneously regulating the contact pressure on a plurality of heat sinks associated with planar semiconductor devices to be cooled is described. A corresponding plurality of elongated rods coupled at their outer ends to one surface of each of the heat sinks extend outwardly through aligned holes in a boundary wall of the chamber. A plunger or other suitable device extends into the chamber through a second opening therein to vary the pressure on the compressible medium and thereby to urge the heat sinks against the associated semiconductive elements with a uniform pressure. Facilities are provided for electrically deactivating the semiconductive elements when the pressure within the chamber falls below a predetermined value.

Do you think this is a good invention? Vote now:

Votes so far: For:(0) Against:(0)
Other info:

Inventors: Novak, Petr (Prague, CS)
Pellant, Michal (Prague, CS)
Reichel, Pavel (Prague, CS)

Application Number: 721377
Filing Date: 1976-09-08
Publication_date: 1978-01-03
Assignee: CKD Praha, oborovy podnik (Prague, CS)
Primary Class(es): 257/718 165/80.4, 174/16.2, 257/727, 257/E23.084, 257/E23.088, 257/E23.098
Other Classes:
US Patent Ref:

3307087	Feb, 1967	Rogers et al.	357/82.
3649738	Mar, 1972	Andersson	357/82.
3703668	Nov, 1972	Bylund et al.	357/82.
3812404	May, 1974	Barkan et al.	357/82.
3852803	Dec, 1974	Walmet et al.	357/79.
3991396	Nov, 1976	Barkan	357/82.
3993123	Nov, 1976	Chu et al.	357/82.

Other Refs:
Primary Examiner: James, Andrew J.
Assistant Examiner:
Attorney: