Title: Index mounting unitary heat sink apparatus with apertured base

Abstract: Disclosed is a unitary heat sink apparatus in the form of a U-shaped body of thermally conductive material adapted for use in connection with semiconductor device packages having a thermally conductive transfer plate adjacent one major face of the device package. Typical of such device packages is the TO-220 plastic power package. One leg of the U-shaped clip urges the thermal transfer plate into intimate contact with a flat portion of the opposite leg by the spring action provided by the base of the U. An aperture in the base of the U allows the leads to extend from the heat sink. Fins are included on one leg of the heat sink and means for attaching the heat sink apparatus to printed circuit boards are also disclosed.

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Inventors: Edwards, Steven F. (Dallas, TX, US)
Johnson, James A. (Lewisville, TX, US)
Jordan, William D. (Dallas, TX, US)
Pritchett, James D. (Dallas, TX, US)

Application Number: 621665
Filing Date: 1975-10-14
Publication_date: 1977-10-18
Assignee: Thermalloy, Inc. (Dallas, TX)
Primary Class(es): 257/718 165/80.3, 174/16.3, 257/722, 257/796, 257/E23.086
Other Classes:
US Patent Ref:

2541828	Feb, 1951	Peck	165/80.
3047648	Jul, 1962	Mowatt	357/80.
3548927	Dec, 1970	Spurling	357/81.
3694703	Sep, 1972	Wilens	357/81.
3783347	Jan, 1974	Vladik	357/81.
3893161	Jul, 1975	Pesak	357/81.

Other Refs:
Primary Examiner: James, Andrew J.
Assistant Examiner:
Attorney: Kanz; Jack A.