Title: Method of treating electroless nickel plating bath

Abstract: The invention resides in the addition of large quantities of sodium fluoride to a chemical plating solution for depositing nickel on a catalytic substrate. The purpose of the addition is to increase the rate of deposition of an electroless nickel plating bath. In this way, heavy deposits may be made on substrates without substantial surface roughness, the control and integrity of the properties of the bath can be better maintained, concentrations of additives needed to maintain control of bath properties can be reduced, and the life of the plating bath can be extended.

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Inventors: Scannell, William G. (Hinsdale, IL, US)

Application Number: 663264
Filing Date: 1976-03-03
Publication_date: 1977-07-26
Assignee: Chromium Industries, Inc. (Chicago, IL)
Primary Class(es): 106/1.27 427/438
Other Classes:
US Patent Ref:

2532283	Dec, 1950	Brenner et al.	106/1.
2886451	May, 1959	Budininkas	106/1.
2886452	May, 1959	Duvall	106/1.
2916401	Dec, 1959	Puls et al.	106/1.
3340073	Sep, 1967	Zirngiebl et al.	106/1.

Other Refs:
Primary Examiner: Hayes, Lorenzo B.
Assistant Examiner:
Attorney: Laff, Whitesel & Rockman