Title: Integrated circuit package removal tool

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Abstract: An extraction tool is described for use with integrated circuit (IC) packages of the type having a metallic heat sink member fused to the chip-enclosing ceramic body. The tool finds particular application in connection with a patented high package density island configuration wherein each IC package is secured on a retention post of a connector which is mounted between, and in close proximity to, adjacent parallel sections of the island cooling frame. The IC package heat sink member has at least one integral extension adapted to contact the frame. In performing its removal function, the present tool is capable of gripping opposite edges of the heat sink member in the limited space between the connector and cooling frame section. Having engaged the heat sink, the tool now permits the initial application of opposing forces respectively to the heat sink and the connector retention post. Finally, the opposing forces are directed upon the heat sink member itself, to provide the firm grasp needed for removal of the package from the connector.


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