Title: Apparatus for contouring edge of semiconductor wafers

Abstract: Apparatus is provided for beveling or rounding the edge of thin, disc-like workpieces, such as silicon wafers integrated circuit masks and the like and includes a rotatable holder for receiving and releasably holding such a workpiece and rotating the workpiece with its edge free of obstruction. A rotating grinding wheel axially parallel to the workpiece and holder and having a V-shaped circumferential groove is urged against the edge of the workpiece by resilient biasing means so that the grinding wheel will be maintained in grinding engagement with the workpiece edge during the rotation of the workpiece.

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Inventors: Sehestedt, William H. (Santa Clara, CA, US)

Application Number: 671392
Filing Date: 1976-03-29
Publication_date: 1977-06-28
Assignee: Macronetics, Inc. (Sunnyvale, CA)
Primary Class(es): 451/258 257/E21.237, 451/254
Other Classes:
US Patent Ref:

1145194	Jul, 1915	Hansen	51/105.
2826872	Mar, 1958	Robbins	51/105.
3274736	Sep, 1966	Brokaw	51/105.
3332172	Jul, 1967	Stern	51/101.
3921788	Nov, 1975	Roberson	198/19.
3953941	May, 1976	Kuhn	51/15.

Other Refs:
Primary Examiner: Smith, Al Lawrence
Assistant Examiner: Godici, Nicholas P.
Attorney: Limbach, Limbach & Sutton