Title: Ceramic mounting and heat sink device

Abstract: This relates to a multi-layer composite metallic sheet having a predetermined coefficient of thermal expansion for use as a heat sink and mounting arrangement when bonded to a ceramic substrate. Since copper has a coefficient of thermal expansion greater than that of ceramic and molybdenum has a coefficient of thermal expansion less than that of ceramic, layers of copper and molybdenum can be combined to provide a composite having a coefficient of thermal expansion equal to that of ceramic. To avoid a bimetallic effect, a core layer of a fused metal is sandwiched between two outer layers of the second metal.

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Inventors: Gernitis, Jeffrey (Oak Ridge, NJ, US)
Butti, Bruno (Englewood Cliffs, NJ, US)

Application Number: 643740
Filing Date: 1975-12-23
Publication_date: 1977-05-31
Assignee: International Telephone & Telegraph Corporation (Nutley, NJ)
Primary Class(es): 428/621 257/703, 257/706, 257/747, 257/E23.106, 428/663
Other Classes:
US Patent Ref:

2697130	Dec, 1954	Korbelak	29/198.
2993271	Jul, 1961	Crapuchettes	29/198.
3147547	Sep, 1964	Kuebrich et al.	29/198.
3620692	Nov, 1971	Franklin et al.	29/195.
3780795	Dec, 1973	Arnold	357/81.

Other Refs:
Primary Examiner: Rutledge, L. Dewayne
Assistant Examiner: Weise, E. L.
Attorney: O'Halloran; John T., Van Der Sluys; Peter C., Ingrassia; Vincent B.