Title: Simplified housing structure including a heat sink for a semiconductor unit

Abstract: A plastic housing structure, for a semiconductor component or integrated circuit, employing a metallic heat conducting member forming a base plate of the housing, the conductor members for electrical connection of the semiconductor component extending from the latter to the base plate and insulated therefrom by a plastic film, with the housing being suitable for reception of semiconductor components of integrated circuits and mounting thereof into conductor boards or layer circuits.

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Inventors: Hartmann, Gunter (Munich, DT)
Schwarz, Joachim-Ullrich (Munich, DT)
Keil, Klaus (Munich, DT)

Application Number: 610757
Filing Date: 1975-09-05
Publication_date: 1977-05-17
Assignee: Siemens Aktiengesellschaft (Berlin & Munich, DT)
Primary Class(es): 257/692 257/722, 257/778, 257/796, 257/E23.051, 257/E23.092, 257/E23.103, 257/E23.125
Other Classes:
US Patent Ref:

3544857	Dec, 1970	Byrne et al.	357/74.
3610870	Oct, 1971	Sakamoto	357/72.
3662230	May, 1972	Redwantz	357/74.
3724068	Apr, 1973	Galli	357/74.
3820153	Jun, 1974	Quinn	357/81.
3825803	Jul, 1974	Budde	357/72.
3864728	Apr, 1975	Peltz et al.	357/71.
3868725	Feb, 1975	Degraaf	357/72.
3938177	Feb, 1976	Hansen et al.	357/70.

Other Refs:
Primary Examiner: James, Andrew J.
Assistant Examiner:
Attorney: Hill, Gross, Simpson, Van Santen, Steadman, Chiara & Simpson