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Primary Examiner: James, Andrew J.
Assistant Examiner:
Attorney: Kanz; Jack A.

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Title: Heat sink with parallel flat faces

Abstract: Disclosed is a unitary heat sink apparatus for dissipating thermal energy generated by semiconductor devices encapsulated in an encapsulation device of the JEDEC TO-202 or Motorola Case 152 device case style. The heat sink is a unitary sheet metal device folded to form two opposed end plates joined by a central barrel portion which acts as a spring to urge the opposed faces of the end plates together. The thermal conductor tab extending from the encapsulation device is held between the opposed faces of the end plates.


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Inventors: Edwards, Steven F. (Dallas, TX, US)
Pritchett, James D. (Dallas, TX, US)

Application Number: 601920
Filing Date: 1975-08-04
Publication_date: 1977-03-15
Assignee: Thermalloy Incorporated (Dallas, TX)
Primary Class(es): 257/718 165/80.3, 174/16.3, 257/732, 257/787, 257/E23.086, 257/E23.103
Other Classes:
US Patent Ref:
3222580Dec, 1965Curll357/81.
3548927Dec, 1970Spurling357/81.
3572428Mar, 1971Monaco357/81.
3670215Jun, 1972Wilkens et al.357/81.
3694703Sep, 1972Wilens et al.357/81.
3893161Jul, 1975Pesak357/81.

Other Refs: Other References: Wakefield Semiconductor Heat Sinks and Thermal Products Distributor Products Catalog No. 102 Copyright 1970.