Title: Apparatus for accurately bonding leads to a semi-conductor die or the like

Abstract: Apparatus for accurately bonding leads to a semi-conductor die or the like includes a hitch feed and guide assembly for sequentially positioning each set of leads on a film carrier format over the die to be bonded to the leads. A micromanipulator adjusts the leads relative to the die prior to bonding. Displacement means provide unambiguous rectilinear separate movement of the bonding tool laterally into alignment with the lead and semi-conductor and then into contact with the leads to apply bonding heat and pressure.

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Other info:

Inventors: Keizer, Alan S. (Huntingdon Valley, PA, US)
Harris, Hugh R. (Levittown, PA, US)

Application Number: 510207
Filing Date: 1974-09-30
Publication_date: 1977-03-08
Assignee: The Jade Corporation (Huntingdon Valley, PA)
Primary Class(es): 228/6.2 226/58, 228/5.5, 228/105, 257/E21.516
Other Classes:
US Patent Ref:

1984143	Dec, 1934	Kraft	226/58.
3611561	Oct, 1971	Dosier	29/626.
3628717	Dec, 1971	Lynch et al.	228/6.
3689991	Sep, 1972	Aird	29/589.
3696985	Oct, 1972	Herring et al.	228/4.
3698618	Oct, 1972	Helda	29/471.
3709424	Jan, 1973	Drees	228/4.
3722072	Mar, 1973	Beyerlein	29/471.
3724068	Apr, 1973	Galli	228/6.
3739463	Jun, 1973	Aird et al.	29/591.
3831252	Aug, 1974	Miller	29/203.

Other Refs:
Primary Examiner: Smith, Al Lawrence
Assistant Examiner: Ramsey, K. J.
Attorney: Seidel, Gonda & Goldhammer