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Primary Examiner: Newsome, John H.
Assistant Examiner:
Attorney: Egan; Russell J.

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Title: Gold deposition procedures and substrates upon which gold has been deposited

Abstract: A method for electroless gold plating in which gold ligand complexes are used; a photolytic method for depositing catalytic amounts of gold on a substrate suitable for an electroless metal deposition method whereby the gold complexes used are trivalent gold complex; a method for immersion plating or vaporization plating of gold from complexes, and complexes for the above methods.

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Inventors: Redmond, John Peter (Mechanicsburg, PA, US)
Andrews, Daniel Marshall (Harrisburg, PA, US)
Guyler, Karl Edward (Harrisburg, PA, US)

Application Number: 553047
Filing Date: 1974-02-25
Publication_date: 1977-02-22
Assignee: AMP Incorporated (Harrisburg, PA)
Primary Class(es): 427/558 427/252, 427/304
Other Classes:
US Patent Ref:

3440113	Apr, 1969	Wolley	427/252.
3537878	Nov, 1970	Baudrand et al.	427/304.
3567488	Mar, 1971	Rathsack	427/304.
3661959	May, 1972	Vaughan	260/430.

Other Refs: Other References: Kowala et al., "Australia J. Chem.", 1966, vol. 19, pp. 539-559.