Title: Assembly of a recessed heat sink and a semiconductor device sealed within the recess in the heat sink and thermally connected to the heat sink

Abstract: A semi-conductor assembly includes a conductive stud and a semi-conductor device mounted on the stud so that a first contact area of the device is thermally and electrically connected thereto. Thermally and electrically connected to a second contact area of the device is an expanded head portion of an electrical lead. A body is shaped to define a recess in which the stud is engaged so that the device is accommodated in the space defined between the stud and the walls of the recess, the electrical lead extending through an aperture in one of said walls. Sealing means prevents ingress of foreign material through the aperture into said space, and a resilient member is trapped and deformed between the head portion of the lead and the body so that the head portion of the lead is urged into pressure contact with the device.

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Inventors: Goodman, Dennis George (Birmingham, EN)

Application Number: 537337
Filing Date: 1974-12-30
Publication_date: 1977-02-08
Assignee: The Lucas Electrical Company Limited (Birmingham, EN)
Primary Class(es): 257/718 257/708, 257/733, 257/E23.092
Other Classes:
US Patent Ref:

3176382	Apr, 1965	Dickson et al.	357/81.
3449506	Jun, 1969	Weinstein et al.	357/81.
3474302	Oct, 1969	Blundell	357/81.
3513360	May, 1970	Andersson et al.	357/79.
3743896	Jul, 1973	Weiske et al.	357/81.

Other Refs: 1,459,516

Oct, 1966	FR

Primary Examiner: James, Andrew J.
Assistant Examiner:
Attorney: