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Title:
Method for producing high power semiconductor device using anodic treatment and enhanced diffusion
Abstract:
A high power semiconductor device is formed by providing a semiconductor substrate of N.sup.- conductivity, rendering the backside of same porous as by subjecting same to anodic treatment carried out in a concentrated solution of hydrofluoric acid, converting the porous region to an N.sup.+ region, as by arsenic diffusion and forming an active device by conventional techniques in the top surface of the substrate. The method permits usage of high quality N.sup.- substrates and at the same time eliminates the requirement of growing thick epitaxial layers.
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Inventors:
Aboaf, Joseph A. (Peekskill, NY, US) Broadie, Robert W. (Hopewell Junction, NY, US) Hull, Edward M. (La Grangeville, NY, US) Pogge, H. Bernhard (Hopewell Junction, NY, US)
Application Number:
657869
Filing Date: 1976-02-13 Publication_date: 1977-02-01 Assignee:
International Business Machines Corporation (Armonk, NY)
Primary Class(es):
438/542
205/157, 205/199, 205/656, 257/578, 257/E21.141, 257/E21.215, 257/E29.003, 257/E29.034, 438/372, 438/928, 438/960
Other Classes:
US Patent Ref:
Other Refs:
Other References:
Lloyd, R. H. F., "Semiconductor Process Control," IBM Tech. Discl. Bull., vol. 11, No. 2, July 1968, p. 143. Poponiak, et al., "Enhanced Diffusion In Porous Silicon." Ibid., vol. 17, No. 6, Nov. 1974, pp. 1598-1599, 1602-1603. Dockerty, et al., "Protection of Porous Silicon from Oxidation and Impurities." |