Title: Heat sink for an appliance circuit board

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Abstract: A heat sink arrangement for a circuit board in a sewing machine which supports the circuit board for ready disassembly therefrom, and makes use of the sewing machine frame as an additional heat sink. The circuit board is riveted to an aluminum heat sink member which carrys the power transistors in a manner to provide good thermal conductivity thereto but electrically isolated therefrom by mica laminae. An aluminum bracket firmly affixed to the sewing machine frame for good thermal conductivity has a large area planar surface thereof contiguous a similar large area planar surface of the heat sink member. A clamp member which extends through a slot in the bracket has a pair of upstanding arms with reentrant angles which touch the surface of the heat sink member opposite the large planar surface. The surface of the bracket opposite the large planar surface is formed with a cylindrical surface at an angle to coact with a cone pointed screw carried by the clamp member. As the cone pointed screw bears against the cylindrical surface of the bracket, the heat sink member and the bracket are brought into intimate contact for good thermal conductivity from the transistors to the frame of the sewing machine. A leaf spring may be included as part of the assembly urging the clamp member towards a released position when the cone pointed screw is retracted from the bracket to facilitate disassembly of the circuit board.


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