Title: Heat-sink assembly for high-power stud-mounted semiconductor device

Abstract: A heat-sink assembly adapted for use with a high-power stud-mounted semiconductor device comprises a heat-dispersing arm having one end securely attached to a circuit board and the other end shaped for semipermanent connection and thermal coupling to a heat-conductive stud. The arm is sufficiently bendable to allow displacement thereof from above the surface of the device mounted on the circuit board for removal of the device from the circuit board after disconnecting the other end from the stud while keeping the one end securely attached to the circuit board. The heat-sink assembly may further comprise means for semipermanently connecting the other end of the arm to the stud and retaining the other end in intimate thermal contact therewith.

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Inventors: Harayda, George Michael (Middlesex, NJ, US)
Austin, Wayne Miller (Flemington, NJ, US)

Application Number: 576607
Filing Date: 1975-05-12
Publication_date: 1977-01-18
Assignee: RCA Corporation (New York, NY)
Primary Class(es): 361/710 174/52.4, 257/722, 257/733, 257/E23.086, 257/E23.103, 361/707
Other Classes:
US Patent Ref:

2701866	Feb, 1955	Chapman	174/16.
2826385	Mar, 1958	Osborn	248/300.
3211822	Oct, 1965	Krall	174/16.
3237905	Mar, 1966	Baker	248/300.
3257621	Jun, 1966	Jadoul	357/81.
3259813	Jul, 1966	Linstrand	174/16.
3271722	Sep, 1966	Garstang	174/16.
3522491	Aug, 1970	Coe	174/16.
3665256	May, 1972	Goun	174/15.
3711752	Jan, 1973	Nier	357/81.
3836825	Sep, 1974	Hall	317/100.

Other Refs:
Primary Examiner: Tolin, Gerald P.
Assistant Examiner:
Attorney: Christoffersen; H., Williams; R. P., Magee; T. H.