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Title: Method of fabricating thin monocrystalline semiconductive layer on an insulating substrate

Abstract: An extremely thin monocrystalline semiconductive layer over an electrical insulator is disclosed, as well as its method of fabrication. The semiconductive layer is of high quality to provide an electrically uniform substrate for fabrication of semiconductive devices. The electrical insulator is also thin, providing a short path for thermal conduction from the semiconductive device. The method of fabricating the structure lends itself to inclusion of a buried layer, either by diffusion or by performing an epitaxial growth at a particular point in the process. The process also lends itself to an optional growth of an epitaxial layer on the semiconductive layer. The insulator may be made of an oxide of the semiconductive layer material, or it may be made of silicon nitride or silicon oxynitride.


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Inventors: Price, James B. (Phoenix, AZ, US)

Application Number: 553769
Filing Date: 1975-02-27
Publication_date: 1977-01-18
Assignee: Motorola, Inc. (Chicago, IL)
Primary Class(es): 438/16 148/DIG51, 148/DIG85, 148/DIG135, 148/DIG162, 257/E21.537, 438/478, 438/700, 438/977
Other Classes:
US Patent Ref:
3171762Mar, 1965Rutz148/175.
3312879Apr, 1967Godejahn156/17.
3422321Jan, 1969Tombs29/571.
3509433Apr, 1970Schroeder29/580.
3523842Aug, 1970Glendinning156/17.

Other Refs:
Primary Examiner: Powell, William A.
Assistant Examiner:
Attorney: Clark; Lowell E.