Title: Semiconductor device with solder conductive paths

Abstract: In devices including a body of semiconductor material having layers of solder on a surface thereof serving as current connectors, flow of solder from the layers to terminal leads soldered to the layers during the terminal lead soldering process is prevented by the presence of a gap between the terminal leads and the solder layers. Electrical connection between the solder layers and the terminal leads is provided by conductive regions within the body to which the terminal leads and the solder layers are contacted.

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Inventors: Einthoven, Willem Gerard (Belle Mead, NJ, US)
Hulstrunk, William (Millburn, NJ, US)

Application Number: 553089
Filing Date: 1975-02-26
Publication_date: 1976-12-14
Assignee: RCA Corporation (New York, NY)
Primary Class(es): 257/784 257/779, 257/786, 257/E21.509, 257/E23.015
Other Classes:
US Patent Ref:

3590339

Jun, 1971

Bilo et al.

357/86.

Other Refs:
Primary Examiner: Wojciechowicz, Edward J.
Assistant Examiner:
Attorney: Christoffersen; H., Williams; R. P., Hays; R. A.