Title: Apparatus for wafer probing having surface level sensing

Abstract: Disclosed is a method and apparatus to improve the capabilities of automatic and semi-automatic diode, integrated chip, and wafer probers. Prober contact with the upper surface of the wafer to be tested is accomplished through an electronic logic circuit triggered by electrical contact of the probe as opposed to a mechanical sensor. This improved surface position signal is supplied to additional digital logic circuitry to operate a vertical axis control mechanism which precisely locates the probes relative to the wafers that will be tested. Thus, prober contacts with test wafers are positively and accurately made improving the reliability of the test stage of wafer production.

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Inventors: Fergason, Lewis A. (O'Fallon, MO, US)
Turnbull, David R. (Edmundson, MO, US)

Application Number: 645175
Filing Date: 1975-12-29
Publication_date: 1976-12-07
Assignee: Monsanto Company (St. Louis, MO)
Primary Class(es): 324/754 324/72.5
Other Classes:
US Patent Ref:

3500192	Mar, 1970	Donaher et al.	324/72.
3702439	Nov, 1972	McGahey et al.	324/158.
3866119	Feb, 1975	Ardezzone et al.	324/158.
3936743	Feb, 1976	Roch	324/158.

Other Refs:
Primary Examiner: Segal, Robert
Assistant Examiner: Sunderdick, Vincent J.
Attorney: Gilster; Peter S.