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Primary Examiner: Smith, Al Lawrence
Assistant Examiner: Ramsey, K. J.
Attorney: Krenzer; Cyril A.

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Title: Wire maze penetrating apparatus

Abstract: Apparatus operative in conjunction with a wire routing and bonding machine, or the like, to selectively penetrate a maze of parallel wires on a printed circuit board and expose an area on the board so that additional wires may be suitably bonded to the exposed area. Utilizing the pressure it experiences when contacting the board surface, the apparatus operates to avoid damage to the printed circuit board surface and at the same time has a high reliability for clearing of wires from the selected area.

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Other info:

Inventors: Houser, David Erle (Apalachin, NY, US)
Lubert, Kenneth John (Endicott, NY, US)
Morenus, Richard Jay (Endwell, NY, US)

Application Number: 639951
Filing Date: 1975-12-11
Publication_date: 1976-11-02
Assignee: International Business Machines Corporation (Armonk, NY)
Primary Class(es): 228/4.5 29/748, 228/5.1
Other Classes:
US Patent Ref:

2850737	Sep, 1958	Walsh	29/203.
3425114	Feb, 1969	Fellenze, Jr.	29/203.
3734386	May, 1973	Hazel	228/4.

Other Refs: Other References: Steranko, "High-Density Bonding Tweezers," IBM Technical Disclosure Bulletin, vol. 10, No. 5, pp. 630-631 (1967).