Title: Thioether sulfonates for use in electroplating baths

Abstract: A composite nickel-containing electroplate is formed on a base metal surface by electroplating on the surface an adherent nickel or nickel alloy layer having a thickness of from about 0.15 to 1.5 mils and an average sulfur content of less than about 0.03%. An intermediate nickel or nickel alloy layer, having a thickness of from about 0.005 to 0.2 mils and an average sulfur content of from about 0.05 to 0.3% is then electroplated on the lower layer. An adherent upper nickel or nickel alloy having a thickness of from about 0.2 to 1.5 mils and average sulfur content of from about 0.02 to 0.15% is then electroplated on the intermediate layer, the upper layer containing a lower percentage of sulfur then the lower layer. The source of sulfur, for at least the intermediate layer, is provided by including novel thioethersulfonates of nitriles or amides in the plating bath for that layer.

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Inventors: Clauss, Richard John (Allen Park, MI, US)
Tremmel, Robert Arnold (Woodhaven, MI, US)
Becking, Donald Harvey (West Bloomfield, MI, US)

Application Number: 556232
Filing Date: 1975-03-07
Publication_date: 1976-10-12
Assignee: Oxy Metal Industries Corporation (Warren, MI)
Primary Class(es): 558/437 205/176, 205/181, 562/105, 562/106
Other Classes:
US Patent Ref:

2330713	Sep, 1943	Holbrook et al.	260/513.
2462406	Feb, 1949	Langkammerer	260/465.
2694718	Nov, 1954	Salminen et al.	260/507.
3112198	Nov, 1963	Klinger	260/507.
3344174	Sep, 1967	Broussalian	260/513.
3502708	Mar, 1970	Thoma et al.	260/465.
3707507	Dec, 1972	Williams	260/465.
3734840	May, 1973	Passal	260/465.

Other Refs:
Primary Examiner: Brust, Joseph Paul
Assistant Examiner:
Attorney: Claeboe; B. F.